AI hardware
High-density power and data looms for compute — edge to rack.
Inference boxes, accelerator sleds, edge appliances: dense enclosures where power distribution and signal looms compete for space and airflow. We build to your routing drawing, with matched lengths and clean labeling so integration goes fast.
What AI hardware teams send us
Power distribution looms
PSU-to-board and high-current board power connectors per spec, crimp-verified.
Management and signal harnesses
Fan, LED, I2C and UART harnesses, labeled per board designator.
Chassis harnesses
Front-panel, sensor and switch wiring built on boards for repeatability.
Ribbon and IDC cable sets
Cut, terminated and keyed per drawing.
Edge camera and sensor cables
Shielded fine-pitch assemblies for edge inference devices.
Internal power jumpers
Short high-current jumpers between boards and busbars, matched lengths recorded.
What gets checked before the PO
Compute builds move fast and run hot. The process is tuned for density, current and speed.
| Density | Fine-pitch and high-current connectors on the same loom; routing held to your drawing |
| Current | Conductors and connectors rated for accelerator power draws — crimps verified |
| Airflow | Bundled and routed to your cable-management plan so looms stay out of the air path |
| Matched lengths | Length sets held to tolerance and recorded |
| Speed | Prototype quantities fast; production on the same line without re-quoting from scratch |
| Testing | 100% continuity; hi-pot per plan |